Advancements in Industrial X-ray Inspection: Ensuring Quality and Safety

Industrial non-destructive inspection mainly adopts conventional methods such as ray inspection, ultrasonic inspection, magnetic particle inspection, eddy current inspection, penetration inspection, and other non-conventional inspection methods such as laser, electromagnetic wave, infrared, and other non-conventional inspection methods. Among them, X-ray has the advantages of wide applicability, good visibility, high accuracy, etc., and is widely used. Manufacturers offer many types of X-ray inspection machine for sale.

Principle of X-Ray Inspection

In an X-ray tube, electrons emitted from the cathode are accelerated by the electric field between the cathode and anode, and then bombard the X-ray anode target, transferring their kinetic energy to the atoms on the target, of which about 1% of the energy is converted into X-rays. The X-rays pass through the samples to be inspected, and interact with the atoms in the samples to cause attenuation of the radiation intensity, and are received by the inspection to generate electrical signals proportional to the intensity of radiation, and are then inspected. The inspection receives the radiation and produces an electrical signal proportional to the intensity of the radiation, which forms an image in the computer system. 

The X-Ray Source Has to Be Matched to the Parameters of the Application

The electrons emitted from the cathode of an X-ray source are focused on a point on the target called the focal point. The size of the focal point of the X-ray emitting source determines the inspection accuracy. The smaller the focal spot size, the higher the accuracy. The tube voltage determines the photon energy and penetrating power of the X-rays. The higher the tube voltage, the greater the penetration of the X-ray source. The tube current determines the image signal-to-noise quality. The higher the tube current, the higher the photon dose and the better the imaging signal-to-noise ratio.

Applications in Integrated Circuits and Electronics Manufacturing

Integrated circuits and electronic manufacturing involves the manufacture/assembly of electronic parts, PCB printing, packaging and so on. With the lightweight electronic products, intelligent development, the size of the semiconductor is constantly shrinking, the integrated circuit packaging density requirements are gradually increased, and the corresponding defects require inspection accuracy to reach the nanometer or micron level. At present, the X-ray inspection machine for sale can meet the complex integrated circuits and electronic manufacturing process of multi-link inspection requirements.

Innovative Applications of X-Ray Inspection

In recent years, with the rapid development of digital imaging technology and computer technology, X-ray inspection has made remarkable progress. Digital X-ray imaging technology has improved the clarity and accuracy of images, making the inspection results more reliable. At the same time, 3D X-ray imaging technology can provide a three-dimensional view of the inside of an object, providing the possibility of detecting complex structures. In addition, the application of technologies such as artificial intelligence and machine learning has further improved the speed and accuracy of image analysis.

Benefiting from the rapid growth of downstream demand, the market space for X-ray inspection equipment is expected to maintain rapid growth. X-ray inspection has become a necessary process before delivery of various types of lithium batteries off the line to ensure the safety and reliability of new energy batteries. SEAMARK provides high quality X-ray inspection machine for sale, if you are interested, please contact us.